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Published: 2024-01-23 23:43:57.764725 Category: Industry Type: Illustration Model release: No
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Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process, generative ai

Contributor: Suralai
ID : 717234844
TitleFilesize
Illustration5333x8000


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Keywords
circuit, component, computer, microchip, processor, technology, transistor, controller, development, device, fabrication, facility, factory, foundry, industrial, industry, integrated, machine, manufacturing, package, process, production, research, science, semiconductor, silicon, disc, nanotechnology, memory, die, electronic, shortage, arm, advanced, robotic, chips, central processing unit, cardboard box, constructed, neon, electrical, hardware, motherboard, business, engineering, music, part, sound


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